Repair - BGA-Rework, SMD-Rework, Spare Parts Service
The repairing of your products and modules is carried out by our trained and qualified technical personnel. A well-equipped measuring laboratory supports our team at work.
Error Analysis
On the basis of circuit diagram study, analysis of the thermal behavior and comparative measurements, the source of error is circled. For more complex problems, the engineers of the development department are additionally available. In some cases it may be necessary to carry out supplementary laboratory tests or obtain microsections.
Reworking of SMD
Through our professional rework system "Martin Expert" by the company Martin, we are capable of unsoldering and soldering back complex SMD components, such as BGA and CSP. Of course, this process takes place under nitrogen and the temperature profile is logged in detail.
BGA Reballing
BGA components are complex and usually expensive. When it is ensured that the component is not defective, it may make sense to use it again. However, after desoldering the solder balls are no longer uniform. Therefore, the BGA is cleaned in a special soldering technique and provided with new solder balls. This is referred to as "reballing".
Spare Parts Service
Thanks to our sophisticated material logistics, we are able to keep a safety or spare parts storage for you.
Documentation
After completion of the works, you receive an informative repair report, which is assigned to the life file of the assembly via the serial number.
Your benefits
- Repairing instead of scrapping reduces costs
- Supervised and logged soldering process protects components
- Soldering process with the addition of nitrogen improves the soldering quality