Automatic THR & SMD placement
The automated placement of SMD (Surface Mounted Devices) and THR components (Through Hole Reflow) forms the backbone of our modern electronics manufacturing. In the automatic SMD placement, three production lines are used with a placement capacity of up to 100 000 components per hour. This offers sufficient spare capacity to implement short-term orders.
We process technologically current and production-technically sophisticated designs from 0201 to QFP304, BGA, CSP and µBGA (Chip Scaled Package) with a possible fine-pitch grid of 0.3 mm. Our specialization is the SMD placement of small and medium series with typically 1-10,000 PCBs per lot.
Also SMD prototypes, typically 1-50 PCBs per lot, are manufactured on the series machines. For you this means no difference in quality between prototype and series production.
Process of SMT Assembly:
Solder Paste Printing
The printing of the solder paste is accomplished through our JetPrinter MY500 of MYDATA®. The paste is printed directly onto the circuit board with a piezo print head, similar to the inkjet printer. By using the JetPrinter, we can individually dispense the paste amounts for each pad, which is especially important for thermal pads under power ICs. Layout changes can easily be entered into the data. It is even possible to combine the paste printing with a glue printing. The accuracy is so high that components up to 0201 can be fitted safely. An integrated 2D paste inspection monitors the print result.
Pick & Place
High-performance placement machines of the company MyData, consisting of MY200DX-14, MY100-Hydra, My15E-Hydra and MY12-Hydra form the backbone of our automatic SMT assembly. They are characterized by short setup times and high flexibility. Comprehensive monitoring of the mounting process and three camera systems per machine ensure high precision. Of course, we can also assemble THR components with our machines.
Vapor Phase Soldering
A special feature at Kuttig Electronic is the vapor phase soldering. On the one hand it protects the components due to the peak temperature of 235°C, which is 30°C lower as usual, on the other hand it is environment-friendly, as it operates without supply of nitrogen. Nevertheless, no oxygen reaches the solder joint, since a liquid film is formed around the solder joint during soldering. Due to the system, overheating of the board is impossible. The Inline systems VP2000, VP3000 and the batch plant VP53 of the company ASSCON are at your disposal.
Reflow Soldering
In addition, we have the modern reflow soldering system Vitronics Soltec MR933. This is used when vapor phase soldering is not possible due to the components, such as white LEDs with gel casting. The reflow system works with pure forced convection without IR-proportions. Twelve temperature zones which are independently adjustable allow the observance of precisely definable temperature profiles. Thus, for almost all boundary conditions, such as kind and amount of solder paste or kind of component, the process can be performed optimally.
- Ausreichende Kapazitätsreserven für kurzfristige Termindienste
- Breites Bauteilspektrum setzt kaum Grenzen
- Hohe Qualitätsstandards für fehlerfreie Produkte
Für die Leiterplattenbestückung haben wir eine Baugruppen-Anfrage-Checkliste vorbereitet. Dort können alle Eckdaten, die wir für die Fertigung benötigen, eingetragen werden.
Checkliste Baugruppen-Anfrage
Muster-Stückliste
Bitte übermitteln Sie uns folgende Unterlagen:
- Eindeutige Stückliste mit Referenzen (vorzugsweise in EXCEL-Format; s. Musterstückliste)
- Bestückungsplan (vorzugsweise als durchsuchbare PDF-Datei)
- Eine Beschreibung von Besonderheiten (falls erforderlich)
- Bei SMD-Baugruppen die Pick & Place File (Mittelpunktskoordinaten als TXT-Datei in ASCII)
Weitere Checklisten und Kontaktmöglichkeiten finden Sie in der Anfrage-Übersicht.