Konnten wir Ihnen mit unserer Erklärung helfen? Bitte bewerten Sie diesen Beitrag:
Vertical Interconnect Access
Vertical Interconnect Access (VIA) is a layered connection in form of a metallized (drilled) hole in a printed circuit board. The connection hole is not used to accommodate component connection conductors, but rather exclusively for the electrical connection of the various layers of the circuit board.
VIA is often written as Via or via as an independent word.